Evolution and status quo of LED display packaging

LED display packaging has developed from early-days DIP (dual in-line package) to today’s multiple packaging methods such as SMD, IMD, and COB,. These methods have reshaped the industry.

 

Since the advent of SMD in 2001, the market share of DIP (direct insertion pattern) packaging has been shrinking annually. However, DIP is still used to ensure product reliability in harsh environments like high-altitude or ultra-low temperature conditions. SMD has played a dominant role in LED packaging for more than a decade. It was not until 2016 that COB began to attract more market attention.
In 2017, SONY launched a Micro-LED display based on flip-chip COB, which inspired the industry to further explore the COB development path. At the end of 2017, the concept of Mini-LED was raised. That greatly accelerated the evolution of pixel pitches towards a finer level. Limited by technology and equipment, conventional single diode SMD packaging reaches it’s smallest size at 0.5*0.5mm. Any smaller packaging size from this point is no longer processable by the current SMT process. This physical limit encouraged the entire industry to explore other technologies such as COB (especially flip-chip COB) to continue its technological evolution.
In 2018, NationStar launched its 4-in-1 IMD09 and put forward the concept of IMD, which combined the advantages of both SMD and COB. This officially began the three-way race between SMD, IMD, and COB in the fine-pitch LED display industry.
 Evolution of LED Diodes Packaging 2000-2019

Fine-pitch LED Display Industry Overview

Definition of fine-pitch LED displays

Fine-pitch LED display generally refers to LED displays with pixel pitch at or below 2.5mm. Mainstream fine-pitch LED display products are referred to as P2.5, P1.8, P1.5, P1.2, P0.9, etc. As technology develops and costs lower, direct-view fine-pitch LED displays are being used in an increasing number of applications, including corporate, retail, and educational settings, control rooms, broadcast studios, 3-D, and virtual or augmented reality displays. Compared with traditional larger-pitch LED displays, fine-pitch LED displays to bring higher resolution (full HD, 4K, 8K, and higher) to the application market, allowing an increasingly broader range of creativity. Fine-pitch LED display is a general term for a larger set of systems, consisting of LED display, HD/UHD display control systems, video processing systems, etc. Fine-pitch LED displays to use pixel-level point control technology to achieve a highly detailed level of brightness, color reproduction, and uniformity in every pixel unit. A key production link in the fine-pitch LED display manufacturing process is Automatic Reflow Welding, which helps to improve the reliability of welding and tremendously reduces the pixel failure rate.

 

IMD 4 in 1 LED

Development history of fine-pitch LED displays

Since LED displays entered the application market, they have developed from single- and dual-color displays to full-color screens, then to fine-pitch. Prior to 1993, LED display screens were limited to red and green dual-color displays and were used in limited applications such as traffic lights and the banking & securities industry. In 1993, Nakamura Shuji invented the blue LED chip, which completed the three primary colors (RGB) and opened a new chapter of full-color displays. In 2001, SMD packaging was introduced, and Chinese LED display manufacturers gradually grew in scale and expanded from domestic to overseas markets. By 2009, European and American enterprises withdrew from the LED display manufacturing market, and Chinese manufacturers became a driving force in the global LED display industry.

Milestones in the LED Display Development History

In 2010, with the launch of the first P2.5mm fine-pitch display, the entire industry began a long-term evolution from outdoor to indoor applications, shifting from larger to finer pitches. The following five years witnessed a stunning 3-digit growth rate with fine-pitch products used in more and more applications. In 2015, facing pressure from Chinese LED display manufacturers, whose compound annual growth rate exceeded 100%, manufacturers of traditional rear-projection and LCD equipment, such as Samsung, Panasonic, Planar, NEC, etc, also joined the fine pitch race. In 2016, Sony-made COB products caught market attention, especially after its Crystal Micro-LED screen, based on COB packaging technology, exhibited at CES in 2017. In the same year, the concept of mini-LED was raised and COB packaging further advanced to flip-chip technology. In 2017, IMD (integrated matrix device, also known as N-in-one) technology was introduced by NationStar with its pioneering product, the 4-in-1 IMD0.9, dividing the fine-pitch market into three major product lines: SMD, IMD, and COB.

 

2020 was expected to be the beginning of the Sub-1 mm Era, with a conservative estimate of 5% of overall fine-pitch sales volume. However, due to the worldwide outbreak of COVID-19, the Sub-1 mm Era may be postponed into 2021 or even 2022.

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flip chip cob led display

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