The development of LED screen package technology from DIP to SMD to IMD to COB is a process of innovation and improvement in response to market demand and technological progress.

• DIP stands for Dual In-line Package. It is the oldest and simplest packaging method, which involves inserting two pins of each LED chip into a plastic holder and soldering them to the PCB board. DIP packaging has the advantages of high brightness, good heat dissipation, and low cost, but it also has the disadvantages of large size, low resolution, and poor color uniformity. DIP packaging is mainly used for outdoor displays with large pixel pitches.
• SMD stands for Surface Mounted Device. It is the most widely used packaging method in the current LED display industry, which involves fixing the LED chips on a bracket, connecting them with gold wires, and protecting them with epoxy resin. The SMD package can integrate red, green, and blue LED chips into one lamp bead, which can be soldered to the PCB board by reflow soldering. SMD packaging has the advantages of small size, large viewing angle, good color mixing, and high reliability, but it also has the disadvantages of low brightness, poor heat dissipation, and high cost. SMD packaging is mainly used for indoor displays with small pixel pitches.
• IMD stands for Integrated Matrix Device. It is a relatively new packaging method that combines the advantages of SMD and COB. It uses surface mount technology to fix the LED chips on a metal substrate and then covers them with a transparent resin film. The IMD package can achieve a smaller pixel pitch than SMD and also has better protection, heat dissipation, and contrast than SMD. However, IMD packaging still faces some challenges such as high cost, complex processes, and low yield.
• COB stands for Chip on Board. It is another emerging packaging method that directly mounts the LED chips on the PCB board and then encapsulates them with epoxy resin or silicone gel. The COB package can achieve a very small pixel pitch, even reaching the level of mini LED and micro LED. It also has excellent protection, heat dissipation, contrast, and reliability. However, COB packaging also has some drawbacks such as high cost, difficult repair, and color inconsistency

 Stability: COB packaged LED displays have higher quality because they do not use brackets, but use silicone or conductive glue to directly paste the chips on the substrate, and then perform wire bonding to achieve electrical connection. MIP packaging is to interconnect the chip electrodes and the substrate electrodes through an interconnect bracket after the LED chip electrodes are made.

Manufacturing Cost:   the P1.2 Mip led screen is comparable in cost to the COB 1.2 led screen. when the dot pitch is less than P1.2, and the comprehensive manufacturing cost of MIP technology is lower than COB technology and SMD technology.