Lateral Chip COB structure VS A Flip-Chip COB structure
Flip chip cob led display advantages
1. Higher stability. Flip chip packaging technology eliminates wire bonding, eliminating the risk of gold wire breakage and simplifying the production process.
2. Smaller pixel pitch. Flip-Chip COB encapsulation is the chip-level integrated encapsulation. Without the wire bonding, the physical space size is only limited by the size of the light-emitting chip, which can achieve higher pixel density.
3. Better visual performance. Regarding display performance, the area of the Flip-Chip is smaller on the PCB board, and the duty cycle of the substrate is increased. It has a larger light-emitting area, which can present a darker black field, higher brightness, and higher contrast Presenting HDR-level display effects.
4. Cost-effective. There is no welding wire link, simplifying the production process and reducing equipment investment costs. As the industry scales, the product cost will be significantly reduced, especially when the dot pitch is less than 1.0mm.
Therefore, Flip-Chip COB technology is a necessary condition for the realization of MicroLED and will go further in the era of micro-display.
The Future Of direct view led display.
Flip-chip COB is an upgraded version of lateral COB, flip-chip COB improves reliability and visual performance, simplifies the production process, and narrows the pixel pitch. COB is the future of direct view led display
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